Latest Research in Electronic Packaging and Soldering Technologies

6 research papers · 2026 median publication year

Top Research Topics in Electronic Packaging and Soldering Technologies

Highest-Cited Papers

  1. Interfacial IMC evolution and mechanical performance of In-doped Sn58Bi solder joints subjected to isothermal aging
  2. Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging
  3. Thermomechanical Reliability of SAC/SB Mixed Solder Containing Sn-58Bi Eutectic Solder
  4. Recent Studies on the Effects of Ni and Bi Addition on Sn-Ag-Cu Solder Properties
  5. Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints
  6. Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints
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L3 Region - - 2026 Sep Q3

Electronic Packaging and Soldering Technologies

6 papers

Top Topics (1)

Electronic Packaging and Soldering Technologies6
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Latest Research in Electronic Packaging and Soldering Technologies (2026) | TGRS