Latest Research in Semiconductor Packaging Reliability

48 research papers · 2026 median publication year

Top Research Topics in Semiconductor Packaging Reliability

Highest-Cited Papers

  1. Research on the Patterning Polyimide Layer Based on Laser Ablation Technology
  2. Role of annealed copper plasticity in process-induced warpage of SiC power modules
  3. Machine Learning-Assisted Calibration of Fission Gas Parameters in the DART Code for U-Mo Fuel
  4. Estimation of electrohydrodynamic force and gas heating fields of plasma actuators using data assimilation
  5. Spatially resolved evaluation of primary displacement damage and activation in the CFETR first-wall components
  6. Fabrication of Millimeter‐Sized Prismatic Silicon Carbide Fibers via a Catalyst‐Free Thermal Evaporation Method
  7. Interconnect diameter effects on the thermo-mechanical reliability of sandwich-structured Cu–Cu bonded stacked dies
  8. Benchmarking of the CMS5 Code System for the NEA/OECD Watts Bar Unit 1 Multi-Cycle Depletion Problem
  9. Room-temperature deposited Ti/Au films on Si toward wafer-level MEMS hermetic packaging
  10. Effects of Precursor Type on Plasma Discharge Characteristics and Polypyrrole Nanostructured Film Properties Using Atmospheric-Pressure Plasma Jets
  11. Amorphization-Mediated Si-I to Si-V Phase Transition and Reversible Amorphous Si-V Phase Memory in Silicon Nanoparticles
  12. Spatially-resolved methane decomposition in a short glow discharge: insights into suprathermal hydrogen and radical chemistry
  13. Low-Temperature Co-Fired Ceramics for a Sustainable Planar Plasma Jet with Homogeneous Plasma in Large Treatment Areas for Biomedical Applications
  14. Bayesian Optimization-Based Machine Learning Inversion of 237NpTransmutation Depletion in ADS
  15. Multichannel discharge modes in atmospheric pressure plasma jet interaction with an offset droplet
  16. Uncertainty quantification propagation in FNG HCPB-tritium breeding module using OpenMC-SANDY workflow
  17. Determination of neutron radiation fields and exposure in geological repositories for high-level spent-fuel radioactive waste
  18. A model of grain growth in UN integrating molecular dynamics, phase-field modeling, and uncertainty quantification
  19. Reinvestigation of the Yield of the Trinity Device
  20. Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies

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L2 Region - - 2026 Sep Q3

Semiconductor Packaging Reliability

48 papers

Top Topics (10)

Electronic Packaging and Soldering Technologies4
Laser-induced spectroscopy and plasma4
Nuclear reactor physics and engineering3
Plasma Applications and Diagnostics3
Materials Science3
Advanced Surface Polishing Techniques3
3D IC and TSV technologies2
Silicon Carbide Semiconductor Technologies2
Fusion materials and technologies2
Plasma Physics2

Top Publications (20)

1.Research on the Patterning Polyimide Layer Based on Laser Ablation Technology2.Role of annealed copper plasticity in process-induced warpage of SiC power modules3.Machine Learning-Assisted Calibration of Fission Gas Parameters in the DART Code for U-Mo Fuel4.Estimation of electrohydrodynamic force and gas heating fields of plasma actuators using data assimilation5.Spatially resolved evaluation of primary displacement damage and activation in the CFETR first-wall components6.Fabrication of Millimeter‐Sized Prismatic Silicon Carbide Fibers via a Catalyst‐Free Thermal Evaporation Method7.Interconnect diameter effects on the thermo-mechanical reliability of sandwich-structured Cu–Cu bonded stacked dies8.Benchmarking of the CMS5 Code System for the NEA/OECD Watts Bar Unit 1 Multi-Cycle Depletion Problem9.Room-temperature deposited Ti/Au films on Si toward wafer-level MEMS hermetic packaging10.Effects of Precursor Type on Plasma Discharge Characteristics and Polypyrrole Nanostructured Film Properties Using Atmospheric-Pressure Plasma Jets11.Amorphization-Mediated Si-I to Si-V Phase Transition and Reversible Amorphous Si-V Phase Memory in Silicon Nanoparticles12.Spatially-resolved methane decomposition in a short glow discharge: insights into suprathermal hydrogen and radical chemistry13.Low-Temperature Co-Fired Ceramics for a Sustainable Planar Plasma Jet with Homogeneous Plasma in Large Treatment Areas for Biomedical Applications14.Bayesian Optimization-Based Machine Learning Inversion of 237NpTransmutation Depletion in ADS15.Multichannel discharge modes in atmospheric pressure plasma jet interaction with an offset droplet16.Uncertainty quantification propagation in FNG HCPB-tritium breeding module using OpenMC-SANDY workflow17.Determination of neutron radiation fields and exposure in geological repositories for high-level spent-fuel radioactive waste18.A model of grain growth in UN integrating molecular dynamics, phase-field modeling, and uncertainty quantification19.Reinvestigation of the Yield of the Trinity Device20.Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies

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