Fluorosilicone resins with perfluorocyclobutylaryloxyethane structure： synthesis, curing and properties

Abstract Fluorosilicone resins possess the advantages of both organic silicon materials and organic fluorine materials, and have attracted extensive attention from researchers. In this papepr, a series of fluorosilicone resins with the structure of perfluorocyclobutylaryloxyethane (PFCB) were designed and prepared. Different PFCB contents of fluorosilicone resins were prepared through hydrolysis condensation under acidic conditions by using perfluorocyclobutylaryloxyethane siloxane monomer as the raw material, methylphenyldimethoxysilane (MPMS) as the quantitative component, and phenyltrimethoxysilane (PTMS) as the co-condensate monomer. and the fluorosilicone resins with PFCB structure located in the main chain were obtained through thermal curing. The thermal stability, hydrophobicity, and dielectric properties of these resins were studied. The results show that the T 10 of the fluorosilicone resins containing the PFCB structure is around 400 o C; as the content of PFCB groups increases, the water contact angle of the fluorosilicone resins increases from 88 o to 113 o ; when the PFCB content is the maximum, the average dielectric constant within the frequency range of 1.5–30 MHz is 2.55.