Modeling and Simulation on Nickel Electroplating Behavior of MLCC with Ni Termination

This study investigates the influence of electrode geometry, dielectric spacing, and surface treatment on the electroplating behavior of multilayer ceramic capacitors (MLCCs). A series of two- and three-dimensional simulations was performed to analyze potential distribution, electric field strength, current density, and nickel ion concentration under different electrode exposure conditions, including flat, protruded, and recessed configurations. The results indicate that fully exposed and closely spaced electrodes generate stronger electric fields and higher current densities, enabling more efficient and uniform metal deposition. In contrast, recessed or widely spaced electrodes produce weaker fields and limited ion migration, resulting in poor plating performance. Mechanical surface treatment was found to significantly improve electrode exposure and surface uniformity, thereby enhancing plating quality. While the simulations covered a range of structural variations, the experimental portion of this study focuses on a single MLCC design with 2 μm dielectric spacing. Key parameters such as plating duration, mechanical treatment, and chemical surface processing will be further examined to establish correlations with the simulated trends. These findings provide valuable insights for optimizing termination plating processes in advanced MLCC manufacturing.