AeroSolder-NiCu™: Low-Pressure Transient Liquid Phase Sintering of Graphene-Passivated Ni-Cu Nano-Alloy Displacing Nano-Silver in SiC/GaN Die-Attach

Preprint presenting AeroSolder-NiCu™, a submicron core-shell Cu@Ni@G nano-alloy in a TLPS vehicle for wide bandgap (SiC/GaN) power module die-attach. Densifies at 195°C under <1 MPa, operates stably >420°C, delivers 230 W/mK thermal conductivity, suppresses electrochemical migration beyond 1,850h, cuts material expense by 95.6% ($110/kg vs $2,500/kg), and saves $71.70 per 800V EV traction inverter.

Authors

Publication Details

Journal
Zenodo (CERN European Organization for Nuclear Research)
Published
2026-11-06
DOI
https://doi.org/10.5281/zenodo.24019004
Primary Topic
Electronic Packaging and Soldering Technologies
Type
preprint
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
NOV
preprint

AeroSolder-NiCu™: Low-Pressure Transient Liquid Phase Sintering of Graphene-Passivated Ni-Cu Nano-Alloy Displacing Nano-Silver in SiC/GaN Die-Attach

Antigravity Advanced Materials Laboratory
Zenodo (CERN European Organization for Nuclear Research)
Electronic Packaging and Soldering Technologies
preprint

AeroSolder-NiCu™: Low-Pressure Transient Liquid Phase Sintering of Graphene-Passivated Ni-Cu Nano-Alloy Displacing Nano-Silver in SiC/GaN Die-Attach

Antigravity Advanced Materials Laboratory
preprint en

Abstract

Preprint presenting AeroSolder-NiCu™, a submicron core-shell Cu@Ni@G nano-alloy in a TLPS vehicle for wide bandgap (SiC/GaN) power module die-attach. Densifies at 195°C under <1 MPa, operates stably >420°C, delivers 230 W/mK thermal conductivity, suppresses electrochemical migration beyond 1,850h, cuts material expense by 95.6% ($110/kg vs $2,500/kg), and saves $71.70 per 800V EV traction inverter.

Zenodo (CERN European Organization for Nuclear Research)
Industry, innovation and infrastructure
Electronic Packaging and Soldering Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Laika access coming soon
AeroSolder-NiCu™: Low-Pressure Transient Liquid Phase Sintering of Graphene-Passivated Ni-Cu Nano-Alloy Displacing Nano-Silver in SiC/GaN Die-Attach — Antigravity Advanced Materials Laboratory · Zenodo (CERN European Organization for Nuclear Research) (2026) | TGRS Research Map | TGRS