Research into the Influence of Technological Factors on the Transformation of Properties and Structure of Low-Fusing Layered Solders

The study was conducted on POIn-52 solder in the form of a foil with a thickness of 200 μm and three-and five-layer POIn-52–Pb composite materials. Data were obtained on the influence of various technological parameters on the properties and structure of solders in the free state and in the form of layered composite materials. These data are necessary for choosing the optimal soldering technology and the possibility of creating compositions using solders. The influence of the interfacial surfaces of composites and their degradation under the influence of heating is shown. Along with mechanical methods of research, metallography and X-ray structural analysis methods were used in the work. The results of mechanical tests in the mode of active tension of POIn-52 and POS-61 solder foils (for comparison) depending on the temperature are necessary to ensure the reliability of the operation of soldered joints under conditions of cyclic temperature changes. It was established that the mechanical properties of composite materials in the form of lead tape, which is clad with soft solder POIn-52, differ sharply from the properties of the constituent materials, which is due to the influence of diffusion processes on the interfacial surfaces. The rational soldering temperature of the composite material was determined, and the inexpediency of using five-layer composites in the outlined operating conditions was also shown.