Achieving High‐Efficiency Thermal Management: Advanced Manufacturing Pathways for Material–Structure–Function Integration in Diamond/Cu Composites

Efficient thermal management has become increasingly important for modern high‐power electronic devices, aerospace systems and advanced energy technologies, where ultra‐high heat fluxes threaten device reliability and operational stability. In this context, material–structure–function integration has emerged as a pivotal strategy for developing next‐generation thermal management systems. Diamond/Cu composites, combining the exceptional thermal conductivity of diamond with the excellent processability of copper, have attracted attention as promising heat‐dissipation materials; however, their practical thermal performance is often constrained by interfacial thermal resistance and the effectiveness of structural heat‐dissipation design. This review presents an overview of recent advances in diamond/Cu composites for integrated thermal management applications. The fundamental factors governing intrinsic thermal conductivity are summarized, with particular emphasis on interfacial engineering strategies that enhance phonon transport and minimize thermal boundary resistance. Recent progress in advanced heat‐dissipation structures, including microchannel heat sinks, heat pipes, triply periodic minimal surface structures and topology‐optimized architectures, is systematically discussed, along with their potential for improving heat transfer through optimized thermal pathways and enhanced convection. The feasibility and challenges of achieving material–structure integration through advanced manufacturing are then analyzed, highlighting additive manufacturing technologies for fabricating complex thermal architectures. Remaining challenges and future directions for diamond/Cu thermal management systems are outlined.