A Novel LS Thermoelastic Model for the Dynamics of the Stress Coupling of a 1D Lamina with Temperature-Dependent Properties

This paper examines the influence of the empirical material coefficient on the propagation of plane waves in a one-dimensional isotropic thermoelastic lamina with temperature-dependent material properties. Lamé’s parameters and thermal conductivity are considered to vary linearly with reference temperature, and the analysis is performed within the exponential formulation of Lord and Shulman’s generalized thermoelastic theory, which includes a single thermal relaxation time to guarantee a finite speed of thermal waves. The coupled governing equations are converted to the Laplace domain to allow analytical treatment, and the resulting expressions are numerically inverted to attain solutions in the physical domain. We derive explicit formulae for the temperature, displacement, expansion, and thermal stress fields. To highlight the impacts of the temperature-dependent properties, the numerical results are shown graphically. Comparisons with the standard Lord–Shulman model and classical coupled theory are presented to highlight the differences in wave behavior and thermoelastic response.