Dielectric–Conductive Synergistic Loss in Ti 4 O 7 ‐Based Porous Composites for Enhanced Thermal Management and Electromagnetic Wave Absorption

With the rapid advancement of highly integrated electronics, electromagnetic (EM) interference and thermal accumulation have emerged as critical challenges. To address these issues, a porous Ti 4 O 7 @carbon nanotubes (CNTs)/methyl vinyl silicone rubber (VMQ) composite is fabricated via a synergistic mechanical mixing, chemical foaming, and hot‐press molding strategy. This hierarchical porous architecture endows the composite with exceptional EM wave absorption, efficient thermal management, and robust mechanical integrity. Mechanistically, Ti 4 O 7 —featuring abundant oxygen vacancies and a narrow bandgap‍—amplifies interfacial polarization and dielectric loss. Concurrently, CNTs construct an elastic conductive network that elevates crosslink density and phonon transport efficiency. Consequently, the composite achieves an outstanding minimum reflection loss of −60.0 dB and an effective absorption bandwidth of 2.67 GHz. Simultaneously, it delivers a thermal conductivity of 0.2239 W m −1 K −1 , representing a 123.9% enhancement over pristine VMQ. The engineered porosity further imparts a tensile strength of 2.04 MPa, an exceptional 641.35% elongation, broad temperature resilience (−196 to 300 °C), and durable hydrophobicity. This multifunctional architecture provides a promising platform for integrated EM protection and thermal management in next‐generation devices.