Chemically Active Interfaces Enable Modular Manufacturing of DLP 3D Printed Hydrogel Electronics

Hydrogel-based flexible sensors are promising for wearable electronics, while digital light processing (DLP) printing enables customized device fabrication. However, DLP manufacturing remains largely limited to monolithic structures because freshly printed hydrogels lack sufficient mechanical stability for constructing curved or enclosed architectures. Here, a modular manufacturing strategy is developed by enabling post-printing polymerization through a sustained radical-generation system comprising Cu2+, lignosulfonate (LS), and ammonium persulfate (APS). Unlike conventional photoinitiated systems that become inactive after light exposure, the Cu2+-LS complex maintains a dynamic Cu2+/Cu+ redox cycle in the dark, continuously activating APS to generate radicals. Consequently, independently printed hydrogel modules undergo interfacial polymerization and reconstruct a continuous covalent network, enabling assembled hydrogels to exhibit bulk-like load-bearing performance with failure occurring outside the assembled interface. The Cu-LS system also introduces mobile ions, imparting intrinsic ionic conductivity for strain sensing without conductive fillers. Using this approach, ring-integrated and kirigami-patterned wearable sensors are fabricated through modular assembly. A fingertip-mounted device achieves 99% accuracy in classifying ten sign-language gestures and enables real-time intelligent wheelchair control. This work converts hydrogel interfaces from inactive boundaries into active reconstruction sites, offering a versatile route to the modular fabrication of mechanically integrated soft electronics.

Authors

Institutions

Publication Details

Journal
ACS Applied Materials & Interfaces
Published
2026-10-30
DOI
https://doi.org/10.1021/acsami.6c17652
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Chemically Active Interfaces Enable Modular Manufacturing of DLP 3D Printed Hydrogel Electronics

Ying Yi, Huanwen Wang, Shun Liu, Ziming Song et al.
6 links
ACS Applied Materials & Interfaces
Advanced Sensor and Energy Harvesting Materials
article

Chemically Active Interfaces Enable Modular Manufacturing of DLP 3D Printed Hydrogel Electronics

Ying Yi, Huanwen Wang, Shun Liu, Ziming Song, Huanrui Zhang, Chunjie Yan
article en

Abstract

Hydrogel-based flexible sensors are promising for wearable electronics, while digital light processing (DLP) printing enables customized device fabrication. However, DLP manufacturing remains largely limited to monolithic structures because freshly printed hydrogels lack sufficient mechanical stability for constructing curved or enclosed architectures. Here, a modular manufacturing strategy is developed by enabling post-printing polymerization through a sustained radical-generation system comprising Cu2+, lignosulfonate (LS), and ammonium persulfate (APS). Unlike conventional photoinitiated systems that become inactive after light exposure, the Cu2+-LS complex maintains a dynamic Cu2+/Cu+ redox cycle in the dark, continuously activating APS to generate radicals. Consequently, independently printed hydrogel modules undergo interfacial polymerization and reconstruct a continuous covalent network, enabling assembled hydrogels to exhibit bulk-like load-bearing performance with failure occurring outside the assembled interface. The Cu-LS system also introduces mobile ions, imparting intrinsic ionic conductivity for strain sensing without conductive fillers. Using this approach, ring-integrated and kirigami-patterned wearable sensors are fabricated through modular assembly. A fingertip-mounted device achieves 99% accuracy in classifying ten sign-language gestures and enables real-time intelligent wheelchair control. This work converts hydrogel interfaces from inactive boundaries into active reconstruction sites, offering a versatile route to the modular fabrication of mechanically integrated soft electronics.

ACS Applied Materials & Interfaces
China University of Geosciences (CN), China University of Geosciences (Beijing) (CN)
National Natural Science Foundation of China, China University of Geosciences, Basic and Applied Basic Research Foundation of Guangdong Province
Industry, innovation and infrastructure
Openalex Percentile: Top 24%
Advanced Sensor and Energy Harvesting Materials
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Laika access coming soon