Computer Modeling of Temperature Conditions in the System Unit of a Personal Computer

This work addresses the critical task of computer modeling of temperature conditions inside a personal computer system unit to improve its reliability and efficiency. A structural-parametric model of a PC is formulated and implemented, allowing for the formalization of key system components and their characteristics. Based on this approach, a detailed 3D geometry of the chassis and internal components was created in SolidWorks. The SolidWorks Flow Simulation module was then used to perform a numerical analysis of thermal conditions and airflow within the enclosure under different load scenarios (idle and high load). The simulation revealed areas of overheating and air stagnation in the baseline configuration. To improve thermal performance, a modified case design is proposed featuring additional ventilation openings and an auxiliary fan. A comparative analysis of the simulation results for the baseline and updated designs showed improved airflow uniformity and heat dissipation efficiency under idle conditions. The practical significance of the work lies in the applicability of the developed methodology for optimizing cooling systems in the design of new and the modernization of existing PCs, contributing to increased equipment lifespan and fault tolerance.