Assessment of Stripping Efficiency of Non-TMAH Based Solvents on Photoresist and Temporary Bonding Materials

Effective removal of photoresist (PR) and Temporary Bonding Materials (TBM) is critical in advanced packaging and three-dimensional integration (3Di) processes within semiconductor manufacturing. Traditional wet stripping methods, primarily based on tetramethylammonium hydroxide (TMAH), offer high performance but pose significant environmental and health risks. To address these concerns, this study explores the use of water-based, environmentally benign stripping formulations developed by Intelligent Fluids as sustainable alternatives. These microemulsion-based "green solvents" are engineered to provide efficient cleaning, enhanced surface wettability, and compatibility with sensitive substrates. A series of laboratory-scale stripping tests were conducted on silicon coupons coated with various PR and TBM layers, comparing the performance of four Intelligent Fluids formulations against a conventional TMAH-based solvent. Post-strip surface characterization was performed using contact angle measurements, scanning electron microscopy (SEM), and Time of Flight Secondary Ion Mass Spectrometry (ToF-SIMS) to evaluate cleanliness and chemical modifications. Solvent durability was also assessed by monitoring performance over successive stripping cycles. The results demonstrate that the Intelligent Fluids formulations achieve comparable or superior cleaning efficiency while being non-toxic and reducing the energy consumption by decreasing the operating temperature during the process, making them promising candidates for next-generation semiconductor cleaning solutions. Keywords: Photoresist (PR), Temporary Bonding Material (TBM), green solvents, Microemulsion, TMAH alternatives, Advanced packaging, 3D integration, Sustainable semiconductor processes, Wet stripping