Resolving the Kay–Dunn limit and the speed–endurance dilemma in ferroelectric Hf0.5Zr0.5O2 for DRAM-class sub-volt capacitors

Abstract Ferroelectric hafnium zirconium oxide can increase charge density in scaled capacitors, but its high coercive field limits the low-voltage, high endurance switching required for dynamic random-access memory and embedded ferroelectric memories. Here we show that plasma-engineered (111)-textured TiN electrodes with N-rich, oxidation-resistant surfaces suppress interfacial oxidation and enable robust switching in 5 nm Hf 0.5 Zr 0.5 O 2 capacitors. The devices exhibit saturated hysteresis at 0.6 V, with 2 P r = 31.5 μC cm −2 and E c = 0.62 MV cm −1 , and no hard electrical breakdown through 10 12 bipolar cycles. Their nucleation-limited switching kinetics extrapolate to sub-nanosecond polarisation reversal at DRAM-relevant capacitor areas. At 1.1 V, circuit simulations of a common plate 1T–1 C cell yield short- and long-term stand-by sensing margins of 482 and 201 mV under a 20 fF bit line load. Electrode texture and interface engineering therefore enable low-voltage, high speed switching without compromising endurance, mitigating the practical Kay–Dunn scaling penalty and the speed–endurance dilemma.

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Journal
Nature Communications
Published
2026-10-29
DOI
https://doi.org/10.1038/s41467-026-78705-4
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
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article

Resolving the Kay–Dunn limit and the speed–endurance dilemma in ferroelectric Hf0.5Zr0.5O2 for DRAM-class sub-volt capacitors

Su Yong Lee, Young Yong Kim, Taegyu Kwon, Geun Hyeong Park et al.
4 links
Nature Communications
Ferroelectric and Negative Capacitance Devices
article

Resolving the Kay–Dunn limit and the speed–endurance dilemma in ferroelectric Hf0.5Zr0.5O2 for DRAM-class sub-volt capacitors

Su Yong Lee, Young Yong Kim, Taegyu Kwon, Geun Hyeong Park, Min Hyuk Park, Sanghyun Jo, JoonSuk Park, Ho Jun Kim, Daewoong Kwon, Young H. Lee, Chang Hwa Jung, Se Hyun Kim, Hyun Woo Jeong, Moonseek Jeong, Hanjin Lim, Hyeong Seok Choi, Sungwook Park, Ga Yeon Lee, Seunghwa Jeong, Da Hyun Kim, Dong Hyun Lee, Yong Hyeon Cho
article en

Abstract

Abstract Ferroelectric hafnium zirconium oxide can increase charge density in scaled capacitors, but its high coercive field limits the low-voltage, high endurance switching required for dynamic random-access memory and embedded ferroelectric memories. Here we show that plasma-engineered (111)-textured TiN electrodes with N-rich, oxidation-resistant surfaces suppress interfacial oxidation and enable robust switching in 5 nm Hf 0.5 Zr 0.5 O 2 capacitors. The devices exhibit saturated hysteresis at 0.6 V, with 2 P r = 31.5 μC cm −2 and E c = 0.62 MV cm −1 , and no hard electrical breakdown through 10 12 bipolar cycles. Their nucleation-limited switching kinetics extrapolate to sub-nanosecond polarisation reversal at DRAM-relevant capacitor areas. At 1.1 V, circuit simulations of a common plate 1T–1 C cell yield short- and long-term stand-by sensing margins of 482 and 201 mV under a 20 fF bit line load. Electrode texture and interface engineering therefore enable low-voltage, high speed switching without compromising endurance, mitigating the practical Kay–Dunn scaling penalty and the speed–endurance dilemma.

Nature Communications
Chonnam National University (KR), Pohang University of Science and Technology (KR), Seoul National University (KR), Samsung (South Korea) (KR), Pohang Accelerator Laboratory (KR), Samsung Electronics (South Korea) (KR), Institute of Engineering Research (KR), Hanyang University (KR)
National Research Foundation, Pohang University of Science and Technology, Seoul National University, Ministry of Science and ICT, South Korea, Samsung, National Center for Inter-University Research Facilities, Seoul National University
Openalex Percentile: Top 24%
Ferroelectric and Negative Capacitance Devices
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