Volume of Fluid Modeling of a Rotating Disk Edge Wetting with Backside Dispenser

This study investigates liquid dynamics at the wafer bevel edge during backside cleaning, exploiting finite volume computational fluid dynamics. Experiments with diluted HF on thermal oxide wafers quantitatively confirmed the wrap around at the bevel for different rotation speeds. We found the addition of inert gas flow highly impacts the liquid wrap around at the bevel, whereas bevel geometry has only minor effects. Moreover, simulations confirmed bevel cleaning becomes challenging when wafer surface is hydrophobic. Finally, we were able to capture effluents back splash from the cup.