INTELLIGENT THERMAL MANAGEMENT FOR ADVANCED SEMICONDUCTOR MANUFACTURING UNDER CHIPS ERA

The CHIPS and Science Act has accelerated investment in domestic semiconductor capacity at the same moment that advanced fabs face increasing thermal density, process precision, utility demand, environmental scrutiny, and climate risk.Intelligent thermal management has therefore become more than an HVAC efficiency problem: it is part of the United States' ability to expand manufacturing without weakening yield, resilience, worker protection, water security, or public accountability.This review traces the development of cleanroom thermal-management scholarship from early energy and airflow studies through mini-environments, measured fan optimization, integrated heat recovery, data-driven HVAC models, and calibrated digital twins.It argues that the CHIPS era should not scale the traditional practice of uniformly high, fixed airflow.The stronger architecture is risk-based and production-aware.Intelligent Thermal Management for Advanced Semiconductor Manufacturing Under Chips ERA https://iaeme.com/Home/journal/JITI 2 editor