Hierarchically Wrinkled Silver Ink as a Platform for Fully Integrated Stretchable Electronic Systems

ABSTRACT The development of high‐performance stretchable electronics continues to be limited by the fundamental trade‐off between electrical conductivity, mechanical resilience, and cost‐effective manufacturability. This work introduces a Silver Hierarchical Responsive ink (SHRink), a universal approach for the fabrication of highly stretchable interconnects, wirings, and skin‐interfaced electrodes. The SHRink demonstrates high electrical conductivity (1.2E04 S cm −1 ), large stretchability (235% max fracture strain), and mechanical durability, maintaining stable electrical performance at 30% strain over 1500 cycles. Skin‐compatibility tests confirmed that SHRink is non‐irritating and suitable for long‐term direct epidermal application. To demonstrate the system‐level translational capability of this technology, we fabricated a fully integrated, stretchable ECG monitoring system. Within this architecture, the interconnects for the stretchable circuit board, wiring, and electrodes are realized through a unified materials platform, eliminating the need for heterogeneous fabrication strategies. This work establishes a scalable and manufacturing‐compatible route toward next‐generation wearable healthcare monitors and fully integrated soft electronic systems.