Simulation-Based Evaluation of Temperature and PCB Thickness Effects on the Performance Efficiency of an RCC Smartphone Charger: ShPlus Model A1025 Charger as a Case Study

Smartphone chargers are switched-mode power supply (SMPS) devices that convert alternating current (AC) into regulated direct current (DC). During operation, heat generated by component losses affects electrical performance, efficiency, and reliability. Thermal behaviour is influenced by printed circuit board (PCB) physical properties. However, the influence of FR-4 PCB thickness on charger performance under varying temperatures has received limited attention. This study therefore investigated the effect of temperature rise on a smartphone charger for various FR-4 PCB thicknesses. A virtual simulation approach was used to investigate the SHPLUS model A1025 charger, modelled as a Ringing Choke Converter (RCC). Nine PCB thicknesses (0.80 mm to 4.00 mm) were considered. Input voltage was varied from 100 V to 240 V AC, while temperature was increased from 35°C to 100°C. An AI-assisted computation was employed to simulate conventional thermal equations and generated performance data for conversion losses and efficiency. Simulation showed that conversion losses increased with temperature, while conversion efficiency decreased correspondingly. Thicker PCBs exhibited slightly higher thermal-related losses. The study concludes that temperature rise adversely affects electrical performance by increasing conversion losses and reducing efficiency. Although PCB thickness influences thermal behaviour, its effect is less significant than operating temperature in RCC chargers. The study recommends adopting optimized PCB design parameters and thermal-management techniques to improve efficiency and stability.