Synergistic Time‐Delay Integration X‐Ray Imaging with Pixelated Cs 3 Cu 2 I 5 Scintillators for High‐Fidelity In‐Line Inspection

ABSTRACT The longstanding trade‐off between spatial resolution and detection sensitivity has hindered X‐ray imaging in high‐speed nondestructive testing. Here, we present a synergistic strategy that integrates time‐delay integration (TDI) linear scanning with a waveguide‐structured pixelated Cs 3 Cu 2 I 5 scintillator array to overcome this limitation. The pixelated architecture effectively suppresses lateral photon scattering while maintaining high light output from a 400‐µm‐thick scintillator layer, achieving a spatial resolution of 27.9 lp mm −1 in X‐ray imaging. By incorporating a multistage TDI configuration, we amplify the collected scintillation photons without compromising spatial resolution, achieving a 29.8‐fold enhancement in sensitivity. Notably, the TDI‐based linear scanning system supports a continuous high‐speed readout rate of 22.3 mm s −1 , enabling real‐time, high‐fidelity X‐ray chip inspection with a throughput exceeding 130 chips per minute. This work establishes a viable pathway for advancing X‐ray imaging toward high‐precision and real‐time X‐ray inspection.