Accurate thermophysical property measurement of microscale independent dielectric films by pyroelectric current analysis

Precisely characterizing the thermophysical properties of thin dielectric films, such as specific heat and thermal conductivity, is essential for the thermal design and thermal management of microelectronic devices. Nevertheless, accurately measuring the thermophysical parameters of thin dielectric films with thicknesses of only a few micrometers continues to pose significant challenges. In this paper, we propose a novel method that can simultaneously measure the multiple thermal parameters of thin dielectric films. The measurement principle is based on the analysis of the pyroelectric response current generated in the dielectric film when subjected to a thermal pulse, with this current being determined by the thermal properties of the material. An iterative fitting method is employed to extract the target thermal parameters by minimizing the difference between the simulated and the experimental current spectrum. The measurement results for several typical dielectric material samples, including polypropylene (PP), polyimide (PI), and polyethylene (PE), are highly consistent with literature data. Additionally, an analysis of the measurement uncertainty is conducted, demonstrating the feasibility and accuracy of the proposed method.

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Publication Details

Journal
International Journal of Thermal Sciences
Published
2026-10-19
DOI
https://doi.org/10.1016/j.ijthermalsci.2026.111427
Primary Topic
Thermal properties of materials
Type
article
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article

Accurate thermophysical property measurement of microscale independent dielectric films by pyroelectric current analysis

Feihu Zheng, Shijie Chen, Mengxing Ma, Zhuqing Pan et al.
International Journal of Thermal Sciences
Thermal properties of materials
article

Accurate thermophysical property measurement of microscale independent dielectric films by pyroelectric current analysis

Feihu Zheng, Shijie Chen, Mengxing Ma, Zhuqing Pan, Yilun Zhang
article en

Abstract

Precisely characterizing the thermophysical properties of thin dielectric films, such as specific heat and thermal conductivity, is essential for the thermal design and thermal management of microelectronic devices. Nevertheless, accurately measuring the thermophysical parameters of thin dielectric films with thicknesses of only a few micrometers continues to pose significant challenges. In this paper, we propose a novel method that can simultaneously measure the multiple thermal parameters of thin dielectric films. The measurement principle is based on the analysis of the pyroelectric response current generated in the dielectric film when subjected to a thermal pulse, with this current being determined by the thermal properties of the material. An iterative fitting method is employed to extract the target thermal parameters by minimizing the difference between the simulated and the experimental current spectrum. The measurement results for several typical dielectric material samples, including polypropylene (PP), polyimide (PI), and polyethylene (PE), are highly consistent with literature data. Additionally, an analysis of the measurement uncertainty is conducted, demonstrating the feasibility and accuracy of the proposed method.

International Journal of Thermal SciencesVol. 233
Tongji University (CN), Minzu University of China (CN)
Openalex Percentile: Top 28%
Thermal properties of materials
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