Stereolithography of Methylphenylpolysiloxane‐Modified Polyurethane Elastomers With Enhanced Low‐Temperature Mechanical Performance
ABSTRACT Flexible sensors play an important role in electronic products and can be widely applied in various fields. At present, the requirements for the preparation of sensors are more and more stringent, not only to meet the complex three‐dimensional structure of the product, and the base material to have softness, tensile and low temperature resistance, but also to give it a repeatable electrical signal and effective baseline recovery. Based on this, this article will adopt the method of preparing organic silicon photosensitive resin and applying it to photocurable 3D printing technology to prepare flexible sensors. Light‐cured 3D printing technology stands out among numerous 3D printing technologies and is widely used in the preparation of flexible sensors, meeting the needs of cutting‐edge electronic products with complex 3D structures. Polyurethane elastomers have excellent tensile and rebound properties, while methylphenyl polysiloxane has excellent flexibility and low temperature resistance. The combination of the two can be used in 3D printing technology to prepare elastomers with tensile and low temperature resistance. On the basis of the photosensitive resin, an ionic liquid is added to form a conductive resin system, and the flexible sensor with repeatable electrical signal and effective baseline recovery is prepared by photocuring 3D printing.
Authors
- Dongxian Zhuo (ORCID: https://orcid.org/0000-0002-9230-9392)
- Jianlei Wang (ORCID: https://orcid.org/0000-0002-3802-3043)
- 蔡翠芳
- Jianhong Gao (ORCID: https://orcid.org/0000-0002-8706-9558)
- Rui Wang (ORCID: https://orcid.org/0000-0002-4049-5971)
- Shaoyun Chen
- Xiaoying Liu
- Shi Li
- Bo Qu
Institutions
- Fujian Normal University (CN)
- Quanzhou Normal University (CN)
- Fujian Research Institute of Light Industry (CN)
- Fujian Institute of Research on the Structure of Matter (CN)
Publication Details
- Journal
- Polymer Engineering and Science
- Published
- 2026-10-18
- DOI
- https://doi.org/10.1002/pen.70969
- Primary Topic
- Photopolymerization techniques and applications
- Type
- article
- Field-Weighted Citation Impact
- 0.00