Anisotropic Behavior and Microstructural Evolution of 5052 Aluminum Alloy During Cryogenic Tensile Deformation
The anisotropic tensile behavior and microstructural evolution of 5052 aluminum alloy under cryogenic conditions were investigated through uniaxial tension along the rolling direction (RD), diagonal direction (DD), and transverse direction (TD) at 25, −120, and −180 °C. Mechanical properties, texture, and fracture were evaluated by SEM and EBSD. Results demonstrate a cryogenically induced synergistic enhancement of both strength and ductility. Compared with room temperature, at −180 °C, the yield strength, ultimate tensile strength, and elongation of the material along RD are increased by 11.4%, 21.5%, and 38.7%, respectively. Mechanical properties show significant anisotropy: higher strength along RD, superior ductility along TD. Cryogenic temperatures suppress DSA, promoting uniform deformation. Low temperatures inhibit dynamic recovery, increase dislocation accumulation, raise grain boundary density and low‐angle grain boundary fraction, with more uniform boundary distribution along TD. Texture shifts from Copper/Brass/R to Cube‐dominated stable textures. Fracture turns from ductile dimples to quasi‐cleavage‐dominated mixed mode at cryogenic temperatures; at −180 °C, RD dimples are finer, and necking is reduced.
Authors
- Guanghui Zhao (ORCID: https://orcid.org/0000-0001-5933-4097)
- Juan Li (ORCID: https://orcid.org/0000-0002-9035-1116)
- Lifeng Ma (ORCID: https://orcid.org/0000-0002-2917-8289)
- Chenchen Zhi (ORCID: https://orcid.org/0000-0002-4945-4519)
- Yitong Zhang (ORCID: https://orcid.org/0009-0000-1138-4503)
- Yanfei Wu
Institutions
- Taiyuan University of Science and Technology (CN)
Publication Details
- Journal
- Advanced Engineering Materials
- Published
- 2026-10-15
- DOI
- https://doi.org/10.1002/adem.71335
- Primary Topic
- Microstructure and mechanical properties
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- National Key Research and Development Program of China