Rotating Magnetic Field-Assisted Vertical Sanding Electroplating Process for Diamond Wire

For coarse-diameter electroplated diamond wires, the traditional horizontal sanding process suffers from inhomogeneous circumferential abrasive distribution, a lengthy manufacturing process, and poor production consistency. To address these issues, a pre-plating-free one-step electroplating process based on rotating magnetic field-assisted vertical sanding is proposed. Through the construction of a high-precision multi-process cooperative control system based on a dual-PLC architecture, systematic optimization of the process parameters from pre-treatment and electrodeposition to post-treatment is realized. Combined with the magnetohydrodynamic (MHD) and electrodeposition kinetic theories, the regulation mechanism of the rotating magnetic field-induced micro-convection effect on the mass transfer of the plating bath, particle dispersion, and grain refinement is revealed, and the kinetic principle by which the bottom-to-top vertical wire-running mode improves the circumferential deposition uniformity of abrasive grains on coarse-diameter wires is clarified. The experimental results show that the breaking force and the number of torsion cycles of the prepared diamond wire under the optimized process conditions are increased by 14.33% and 175.80%, respectively, and the properties of the head and tail ends of the wire exhibit high consistency. This study provides theoretical support for the industrial production of high-quality, high-consistency coarse-diameter diamond wires.