Physics-Informed Simulated-Annealing Path-Planning for Mitigating Thermal Accumulation During Nanosecond Laser Drilling of PMMA Micro-Hole Arrays

The high-precision laser micromachining of thermally sensitive PMMA polymers is severely limited by thermal accumulation, which deteriorates the surface quality of micro-hole arrays. Current laser drilling path optimization strategies predominantly prioritize geometric efficiency by minimizing travel distance, whereas quantitative thermal-constrained path optimization for PMMA micro-hole drilling remains underexplored. This work proposes a constrained simulated-annealing (SAA) path-planning strategy that embeds physical thermal constraints (critical thermal radius R and spacing threshold M) into the classic meta-heuristic algorithm, effectively suppressing transient thermal superposition between adjacent micro-holes while maintaining acceptable machining efficiency. Compared with the conventional sequential scanning mode (SSM), the SAA strategy reduces the molten deposit width around micro-holes by 22.3% under identical machining conditions (3 W laser power, 60 mm/s scanning speed, and a single scanning pass). A inherent trade-off is also observed: the thermally isolated jump path increases the total travel distance, resulting in approximately 1.3-fold longer machining time. Benefiting from the suppressed thermal accumulation, the SAA path effectively eliminates thermal-induced micro-hole coalescence at a compact hole spacing of 50 μm, yielding well-defined micro-hole contours and enabling the reliable fabrication of high-quality E-shaped structural color patterns with tunable optical responses under natural light.

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Publication Details

Journal
Micromachines
Published
2026-10-08
DOI
https://doi.org/10.3390/mi17101172
Primary Topic
Laser Material Processing Techniques
Type
article
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article

Physics-Informed Simulated-Annealing Path-Planning for Mitigating Thermal Accumulation During Nanosecond Laser Drilling of PMMA Micro-Hole Arrays

Shangkai Chen, Ming Li, Jing Liu, Yimin Feng et al.
Micromachines
Laser Material Processing Techniques
article

Physics-Informed Simulated-Annealing Path-Planning for Mitigating Thermal Accumulation During Nanosecond Laser Drilling of PMMA Micro-Hole Arrays

Shangkai Chen, Ming Li, Jing Liu, Yimin Feng, Guanglu Wei, Mian Zheng, Liwang Zheng
article en

Abstract

The high-precision laser micromachining of thermally sensitive PMMA polymers is severely limited by thermal accumulation, which deteriorates the surface quality of micro-hole arrays. Current laser drilling path optimization strategies predominantly prioritize geometric efficiency by minimizing travel distance, whereas quantitative thermal-constrained path optimization for PMMA micro-hole drilling remains underexplored. This work proposes a constrained simulated-annealing (SAA) path-planning strategy that embeds physical thermal constraints (critical thermal radius R and spacing threshold M) into the classic meta-heuristic algorithm, effectively suppressing transient thermal superposition between adjacent micro-holes while maintaining acceptable machining efficiency. Compared with the conventional sequential scanning mode (SSM), the SAA strategy reduces the molten deposit width around micro-holes by 22.3% under identical machining conditions (3 W laser power, 60 mm/s scanning speed, and a single scanning pass). A inherent trade-off is also observed: the thermally isolated jump path increases the total travel distance, resulting in approximately 1.3-fold longer machining time. Benefiting from the suppressed thermal accumulation, the SAA path effectively eliminates thermal-induced micro-hole coalescence at a compact hole spacing of 50 μm, yielding well-defined micro-hole contours and enabling the reliable fabrication of high-quality E-shaped structural color patterns with tunable optical responses under natural light.

MicromachinesVol. 17(10)
South Central Minzu University (CN), Inner Mongolia Electric Power (China) (CN), Wuhan Ship Development & Design Institute (CN)
Openalex Percentile: Top 18%
Laser Material Processing Techniques
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