Synergistic Suppression of Ionic Conduction and Lattice Thermal Conductivity Through Trigonally Coordinated [CuI 3 ] 2− Units and Zero‐Dimensionality in Cs 3 Cu 2 I 5
ABSTRACT Semiconductors with ultralow lattice thermal conductivity (κ L ) are promising for thermoelectric and thermal barrier applications. Superionic materials often exhibit ultralow κ L because of their weak chemical bonds and long‐range ion migration, but their practical use is limited by chemical instability under a temperature gradient or an electrical field. Herein, we demonstrate that the synergy of the trigonally coordinated [CuI 3 ] 2− units and the zero‐dimensional (0D) structure of Cs 3 Cu 2 I 5 provides a platform for simultaneously achieving ultralow κ L and negligible ionic migration. Electron diffraction analysis reveals that the weakly bonded, confined trigonally coordinated [CuI 3 ] 2− units promote Cu + rattling, evidenced by a large anisotropic atomic displacement parameter of 0.105 Å 2 at 96 K, indicating strong anharmonicity. Meanwhile, the 0D framework effectively inhibits Cu + migration, giving Cs 3 Cu 2 I 5 an ultralow κ L of 0.15‐0.14 W/mK and negligible ionic conductivity over 300–473 K. Theoretical calculations further unveil that the ultralow lattice thermal conductivity originates from the combined effects of low sound velocity and strong anharmonic phonon scattering, leading to concurrently suppressed particle‐like and wave‐like thermal transport. These findings establish that weakly bonded units confined within a 0D framework constitute an effective design strategy for simultaneously achieving ultralow κ L and suppressed ionic conduction.
Authors
- Zhonghao Xia (ORCID: https://orcid.org/0000-0002-1202-7521)
- Petr Levinský (ORCID: https://orcid.org/0000-0002-8501-1256)
- Philippe Boullay (ORCID: https://orcid.org/0000-0002-2867-8986)
- R. Viennois (ORCID: https://orcid.org/0000-0003-4542-2699)
- Jiangang He (ORCID: https://orcid.org/0000-0001-9643-3617)
- Jiří Hejtmánek (ORCID: https://orcid.org/0000-0001-8248-3912)
- Emmanuel Guilmeau (ORCID: https://orcid.org/0000-0001-7439-088X)
- Jiongzhi Zheng (ORCID: https://orcid.org/0000-0001-9841-7477)
- Chun‐Chuen Yang (ORCID: https://orcid.org/0000-0003-2146-2020)
- Wang Chun-hai
- Bernard Hehlen (ORCID: https://orcid.org/0000-0003-4019-683X)
- Jianyuan Wang (ORCID: https://orcid.org/0000-0002-2109-358X)
- Jia-Yen Chen (ORCID: https://orcid.org/0009-0008-9526-4979)
- Mani Jayaraman
- Lincong Ji
- Xingchen Shen (ORCID: https://orcid.org/0000-0003-1293-1067)
- Ming‐Hsuan Liao
Institutions
- Dartmouth College (US)
- Centre National de la Recherche Scientifique (FR)
- Northwestern Polytechnical University (CN)
- Université de Montpellier (FR)
- National Central University (TW)
- Normandie Université (FR)
- Institut Charles Gerhardt Montpellier (FR)
- FZU ‒ Institute of Physics of the Academy of Sciences of the Czech Republic (CZ)
- Laboratoire Charles Coulomb (FR)
- State Key Laboratory of Solidification Processing
- University of Science and Technology Beijing (CN)
- Université de Caen Normandie (FR)
Publication Details
- Journal
- Advanced Functional Materials
- Published
- 2026-10-06
- DOI
- https://doi.org/10.1002/adfm.78763
- Primary Topic
- Thermal properties of materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00