Thermal management of an electronic board using a fluid-based heat sink equipped with thermal energy storage materials

The growing power density and miniaturization of electronic components have intensified the need for advanced thermal management systems capable of maintaining device reliability under high heat fluxes. In this context, the present numerical study explores the thermal performance of a Liquid-based Heat Sink integrated with Thermal Energy Storage Materials (LQ-HS-TESM) for effective temperature control of an electronic board. A three-dimensional transient model of the LQ-HS-TESM unit is developed and simulated under a wide range of operating conditions to evaluate the influence of key parameters, including the coolant mass flow rate, inlet temperature, power input, and nanoparticle dispersion within the TESM. The results indicate that the proposed LQ-HS-TESM effectively maintains the board temperature below critical limits. The steady-state board temperatures are 35.1 °C, 37.8 °C, 40.4 °C, and 43.1 °C at power inputs of 30 W, 45 W, 60 W, and 75 W, respectively. Increasing the water mass flow rate from 9 kg/h to 18 kg/h reduces the board temperature from 42.7 °C to 40.4 °C, while further increases have a marginal effect. Additionally, raising the inlet temperature from 30 °C to 45 °C increases the steady-state board temperature from 40.4 °C to 55.1 °C. Besides, incorporating multi-walled carbon nanotubes into the TESM significantly enhances its thermal conductivity, facilitating faster heat transfer and reducing the duration of the standby (solidification) phase. Overall, the proposed LQ-HS-TESM design exhibits remarkable capability in regulating board temperature, ensuring stable operation even at elevated power levels and coolant temperatures. The study provides a comprehensive understanding of the coupled effects of latent heat storage, liquid convection, and nanoparticle enhancement, offering valuable insights for the design of next-generation hybrid cooling systems for high-power electronic devices.