Microscale 3D‐Printed Digital Strain Switches for Embedded Mechanical Computation
ABSTRACT Conventional strain sensors output continuous analog signals requiring amplification, filtering, and digital conversion, adding hardware that increases size, weight, and power (SWaP), complicating low‐SWaP applications. Here, we introduce microscale digital strain switches that open and close at a designed strain threshold, delivering a native digital output without additional signal conditioning. Devices are directly printed on flexible films via two‐photon polymerization followed by metallization and laser ablation for trace isolation. A closed‐form kinematic model maps chevron geometry to threshold strain, prescribing threshold targets between and microstrain (). Digital image correlation (DIC) shows results across 110 devices agree with model predictions within 5% after an empirical correction factor is added to compensate for polymer shrinkage and film stress. Electrical characterization of devices yielded , and no switch bouncing was observed across 50 closure events. Sensors operate reliably through the maximum cycles tested. Series and parallel wiring of strain switches demonstrates strain‐activated AND, OR, and XOR logic with zero standby power at the device level. Together, the printed sensors and geometry‐to‐threshold framework enable distributed, ultra‐low‐power event detection in compliant systems and suggest a pathway to embedded mechanical computation.
Authors
- Regan Kubicek (ORCID: https://orcid.org/0000-0002-6951-411X)
- Sarah Bergbreiter (ORCID: https://orcid.org/0000-0003-2735-0206)
- Gabriel Smith
- Daniel Quinn (ORCID: https://orcid.org/0009-0003-3987-8961)
Institutions
- DEVCOM Army Research Laboratory (US)
- Carnegie Mellon University (US)
Publication Details
- Journal
- Advanced Materials Technologies
- Published
- 2026-09-28
- DOI
- https://doi.org/10.1002/admt.71359
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00