Identification of Counterfeit Integrated Circuits Using a Low-Cost Near-Field Microprobe Scanning Setup

Abstract The threat posed by counterfeit electronics has grown since the 2020 supply chain shutdown, increasing the necessity for a fast, non‑destructive method that flags suspect parts with high confidence. This paper describes a custom, low‑cost, two‑dimensional near‑field‑scanning system that uses self‑built electromagnetic probes and streamlined signal‑processing software to identify relabelled or cloned integrated circuits by their unique emission footprints. Case‑study measurements on known relabelled and cloned samples of type STM32 and FTDI with verification by X-ray imaging demonstrate the setup’s effectiveness and simplicity for routine counterfeit screening.

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Publication Details

Journal
Journal of Failure Analysis and Prevention
Published
2026-09-28
DOI
https://doi.org/10.1007/s11668-026-02595-3
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

Identification of Counterfeit Integrated Circuits Using a Low-Cost Near-Field Microprobe Scanning Setup

Sebastian Brand, Michael Kögel, Sebastian Tismer, Frank Altmann et al.
Journal of Failure Analysis and Prevention
Integrated Circuits and Semiconductor Failure Analysis
article

Identification of Counterfeit Integrated Circuits Using a Low-Cost Near-Field Microprobe Scanning Setup

Sebastian Brand, Michael Kögel, Sebastian Tismer, Frank Altmann, Adrian Juwien
article en

Abstract

Abstract The threat posed by counterfeit electronics has grown since the 2020 supply chain shutdown, increasing the necessity for a fast, non‑destructive method that flags suspect parts with high confidence. This paper describes a custom, low‑cost, two‑dimensional near‑field‑scanning system that uses self‑built electromagnetic probes and streamlined signal‑processing software to identify relabelled or cloned integrated circuits by their unique emission footprints. Case‑study measurements on known relabelled and cloned samples of type STM32 and FTDI with verification by X-ray imaging demonstrate the setup’s effectiveness and simplicity for routine counterfeit screening.

Journal of Failure Analysis and Prevention
Deutsche Bahn (Germany) (DE), Fraunhofer Institute for Microstructure of Materials and Systems (DE)
Openalex Percentile: Top 22%
Integrated Circuits and Semiconductor Failure Analysis
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