Identification of Counterfeit Integrated Circuits Using a Low-Cost Near-Field Microprobe Scanning Setup
Abstract The threat posed by counterfeit electronics has grown since the 2020 supply chain shutdown, increasing the necessity for a fast, non‑destructive method that flags suspect parts with high confidence. This paper describes a custom, low‑cost, two‑dimensional near‑field‑scanning system that uses self‑built electromagnetic probes and streamlined signal‑processing software to identify relabelled or cloned integrated circuits by their unique emission footprints. Case‑study measurements on known relabelled and cloned samples of type STM32 and FTDI with verification by X-ray imaging demonstrate the setup’s effectiveness and simplicity for routine counterfeit screening.
Authors
- Sebastian Brand (ORCID: https://orcid.org/0000-0003-2278-2042)
- Michael Kögel (ORCID: https://orcid.org/0000-0003-0629-3855)
- Sebastian Tismer
- Frank Altmann (ORCID: https://orcid.org/0000-0002-0202-1193)
- Adrian Juwien
Institutions
- Deutsche Bahn (Germany) (DE)
- Fraunhofer Institute for Microstructure of Materials and Systems (DE)
Publication Details
- Journal
- Journal of Failure Analysis and Prevention
- Published
- 2026-09-28
- DOI
- https://doi.org/10.1007/s11668-026-02595-3
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00