Thermal-hydraulic performance of novel microchannel–jet hybrid cooling structures for high heat flux applications

To address the severe challenges posed by high heat flux in electronic components, this study proposes two novel micro-jet structures and three microchannel heat sinks, which are integrated into four microchannel-jet hybrid cooling configurations. These configurations combine conventional jet nozzles with baseline microchannel heat sinks, newly-designed micro-jet nozzles paired with baseline and thinned-central-region heat sinks, as well as central-return-orifice micro-jet nozzles integrated with peripherally-modified strip-fin heat sinks. Numerical simulations are conducted to systematically evaluate the surface temperature, average convective heat transfer coefficient, Nusselt number, total pressure drop, and local pressure drop under different heat flux densities and coolant flow rates. Compared with the conventional structure, the proposed jet structure A achieves a reduction in total pressure drop of 30.41%–40.16% without sacrificing cooling performance. Among the four hybrid configurations, configuration BC exhibits the best thermal performance, achieving a 52.4% enhancement in average heat transfer coefficient and maintaining the maximum heat source temperature below 341.6 K at 500 W/cm 2 . These results demonstrate that the proposed microchannel-jet hybrid cooling configurations provide an effective solution for thermal management under high heat flux conditions.