Phosphorylated MXene Composites Integrated with a Low-Melting-Point Alloy for High-Efficiency Electromagnetic Interference Shielding and Enhanced Mechanical Performance

Abstract MXene has attracted considerable attention for electromagnetic interference (EMI) shielding due to its superior electrical conductivity. However, its practical application is hindered by inherent limitations, including susceptibility to oxidation, disordered stacking, and mechanical brittleness. Herein, we report a layered EMI composite (P-MXene@LMPA) fabricated via an interfacial modification strategy, followed by hot-pressing densification. This approach employs sodium hexametaphosphate (SHMP) as a dual-function antioxidant and a “molecular bridge”, which effectively inhibits MXene oxidation during processing while enhancing surface wettability. Consequently, the infiltration of a low-melting-point alloy (LMPA) into MXene interlayers is facilitated during hot pressing, establishing a unique “MXene−molecular bridge−LMPA” continuous conductive network. Attributed to this dense layered architecture and synergistic interfacial effects, the composite demonstrates superior electromagnetic shielding performance. The synergistic combination of rigid MXene and ductile LMPA phases significantly enhanced the mechanical properties, yielding a compressive strength of approximately 65.78 MPa. It presents an effective strategy to mitigate the instability and brittleness of MXene, offering a promising solution for high-performance EMI shielding in advanced electronics and packaging.