From Molecular Design to Applications: A Comprehensive Review on Modifying Bismaleimide-Triazine Resin Substrates for Advanced Electronic Packaging and Communications

Abstract Bismaleimide-Triazine (BT) resins are high-performance thermosetting polymers characterized by interpenetrating polymer networks (IPNs) or co-reacted network structures. As core dielectric materials, they combine low dielectric constant (Dk), low dissipation factor (Df), and good thermal stability (Tg > 250 °C), supporting their use in advanced IC packaging and aerospace radomes. However, their intrinsic brittleness derived from high cross-link density necessitates toughening modifications. Furthermore, rapid growth in AI computing, high-speed communications, and satellite systems is increasing the demand for BT resins with lower dielectric loss and improved thermomechanical reliability. This review summarizes recent modification strategies, ranging from molecular structure design and reactive polymer blending to functional nanofiller and glass fabric reinforcement. Emphasis is placed on establishing fundamental structure-property relationships, clarifying how specific microstructural changes govern the dielectric response, thermal stability, and processability of BT resins. Ultimately, this review highlights the successful translation of these material innovations into cutting-edge functional applications, including memory chips, mmWave antenna substrates, high-speed data center interconnects, and satellite communications. This review may provide perspectives for the future development of advanced electronic packaging materials.