ВПЛИВ СКЛАДУ ЕЛЕКТРОЛІТУ НА ЛОКАЛЬНЕ ЕЛЕКТРООСАДЖЕННЯ НІКЕЛЕВОГО РЕЗИСТУ

The study determines the influence of sulphate electrolyte composition on the localization of the nickel electrodeposition process and investigates the effect of nickel layer formation parameters on its stability under technological conditions of etching the conductive pattern of printed circuit boards in an alkaline copper–chloride solution. Special attention is given to comparing the influence of additives (saccharin and brighteners) on the localization of deposition and the protective properties of nickel. The presence of additives in electrolyte appeared to increase the localization of electric field, however, nickel layer, obtained in additive-containing electrolyte, possesses weak resistance and easily dissolve in etching solution. Nickel layer, obtained in additive-free electrolyte, showed acceptable resistance with the thickness of 2 mm. The results obtained provide a foundation for further research in the field of electrochemical 3D printing and the integration of localized electrodeposition technologies into the fabrication processes of high-density printed circuit boards.