Auxetic Carbon Metastructures for GaN Devices: A Reproducible Thermal-Mechanical Validation Framework

Auxetic carbon metastructures are investigated as candidate structures for combined thermal management and mechanical resilience in GaN devices. This work establishes a reproducible thermal-mechanical validation framework for evaluating those concepts without treating earlier simulation outputs as independently established results. The framework distinguishes bulk constitutive properties from effective metastructure properties, material identity from idealized design assumptions, and mechanical energy absorption from thermal dissipation. It defines requirements for explicit geometry, measurement- or literature-grounded material inputs, fair control structures, interface thermal conductance, solver convergence, uncertainty reporting, falsification, and independent reproduction. Earlier numerical results in the associated research lineage are preserved as historical provenance rather than treated as experimentally validated performance. The purpose of this work is to provide a controlled and reproducible path for determining which thermal-mechanical benefits, if any, survive realistic material properties, interfaces, fabrication constraints, uncertainty, and independent reproduction.