Design of heat dissipation structure and analysis of heat dissipation characteristics of inner TracKer in China's next-generation electron-positron collider

A constraint-driven embedded liquid-cooled heat dissipation tube bundle (HDTB) was designed for the readout electronics boards of the Inner TracKer based on μRWELL (ITKW) in the Super Tau-Charm Facility (STCF), China's next-generation electron–positron collider. Because the readout electronics boards are still under development, a computational model of heat generation and dissipation was developed using heat-generating boards as surrogates to evaluate the heat dissipation performance of the HDTB and was validated experimentally using an HDTB performance testing platform. The effects of coolant inlet velocity, coolant inlet temperature, and the equivalent thickness of the thermal-grease-filled interface on the heat dissipation performance of the HDTB were systematically investigated. Within the investigated ranges, the HDTB maintained the maximum temperature of the 8 W heat-generating boards below 311 K, 69.9 K lower than under the uncooled condition. Increasing the coolant inlet velocity reduced the average temperature of the heat-generating boards, but the overall heat transfer performance of the HDTB deteriorated. Decreasing the coolant inlet temperature reduced the average temperature of the heat-generating boards and improved the heat dissipation performance of the HDTB. The equivalent thickness of the thermal-grease-filled interface had only a limited effect on the heat dissipation performance of the system, although increasing this thickness slightly degraded the overall heat transfer performance of the HDTB. The proposed configuration substantially reduced the maximum and average temperatures of the heat-generating boards and improved temperature uniformity by reducing the board-to-tube-wall thermal resistance. These findings provide direct technical support for the development of the STCF-ITKW.

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Publication Details

Journal
Applied Thermal Engineering
Published
2026-09-14
DOI
https://doi.org/10.1016/j.applthermaleng.2026.133248
Primary Topic
Superconducting Materials and Applications
Type
article
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article

Design of heat dissipation structure and analysis of heat dissipation characteristics of inner TracKer in China's next-generation electron-positron collider

Jiadong Ji, Yi Zhou, Lixuan Zhang, Qixuan Huang et al.
Applied Thermal Engineering
Superconducting Materials and Applications
article

Design of heat dissipation structure and analysis of heat dissipation characteristics of inner TracKer in China's next-generation electron-positron collider

Jiadong Ji, Yi Zhou, Lixuan Zhang, Qixuan Huang, Chengzhi Duan, Fan Ye, Siqi He
article en

Abstract

A constraint-driven embedded liquid-cooled heat dissipation tube bundle (HDTB) was designed for the readout electronics boards of the Inner TracKer based on μRWELL (ITKW) in the Super Tau-Charm Facility (STCF), China's next-generation electron–positron collider. Because the readout electronics boards are still under development, a computational model of heat generation and dissipation was developed using heat-generating boards as surrogates to evaluate the heat dissipation performance of the HDTB and was validated experimentally using an HDTB performance testing platform. The effects of coolant inlet velocity, coolant inlet temperature, and the equivalent thickness of the thermal-grease-filled interface on the heat dissipation performance of the HDTB were systematically investigated. Within the investigated ranges, the HDTB maintained the maximum temperature of the 8 W heat-generating boards below 311 K, 69.9 K lower than under the uncooled condition. Increasing the coolant inlet velocity reduced the average temperature of the heat-generating boards, but the overall heat transfer performance of the HDTB deteriorated. Decreasing the coolant inlet temperature reduced the average temperature of the heat-generating boards and improved the heat dissipation performance of the HDTB. The equivalent thickness of the thermal-grease-filled interface had only a limited effect on the heat dissipation performance of the system, although increasing this thickness slightly degraded the overall heat transfer performance of the HDTB. The proposed configuration substantially reduced the maximum and average temperatures of the heat-generating boards and improved temperature uniformity by reducing the board-to-tube-wall thermal resistance. These findings provide direct technical support for the development of the STCF-ITKW.

Applied Thermal EngineeringVol. 306
University of Science and Technology of China (CN), Anhui University of Science and Technology (CN)
Affordable and clean energy
Openalex Percentile: Top 20%
Superconducting Materials and Applications
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