Process Parameter Optimization and Crack Formation Mechanism of Femtosecond Laser Welding of Fused Silica/6061 Aluminum Alloy

Fused silica–aluminum alloy dissimilar connections are in urgent demand in fields such as aerospace optoelectronic packaging, vacuum optical windows, and micro-electro-mechanical systems, yet the dramatic mismatch in thermal-expansion coefficient and thermophysical properties between the two materials has long been a bottleneck for reliable joining. Current ultrafast laser welding of such heterogeneous systems still suffers from prominent problems, including stringent optical contact requirements, high crack sensitivity on the fused silica side, and unclear coupling mechanism between clamping conditions and joint defects. This work systematically studies the joining process of femtosecond laser welding of fused silica and 6061 aluminum alloy dissimilar materials, focusing on the effects of scanning speed, pulse energy, scanning spacing, and fixture preload on the shear strength, microstructure, and elemental diffusion behavior of the joints. The results confirm that scanning speed and scanning spacing have a synergistic effect on heat input density; the magnitude of the fixture preload is a key factor determining the interfacial residual stress and crack sensitivity. By optimizing the scanning speed (6 mm/s) and combining it with a low preload and 140 μm scanning spacing, a high-strength heterogeneous joint with uniform elemental transition and no macroscopic cracks can be obtained. This study provides a detailed process-optimization approach for high-quality laser welding of dissimilar brittle/ductile materials.