A Dual-Path IoT Sensing and Communication Framework for Smart Building and Construction-Site Structural Monitoring
Reliable structural monitoring for smart buildings and construction sites requires more than sensor acquisition; it requires sensing and communication paths that remain traceable, recoverable, and compatible with platform-side data processing under heterogeneous field constraints. This study presents a dual-path IoT sensing and communication framework that deliberately separates high-data-rate vibration monitoring from low-data-rate inclination-status monitoring while maintaining common requirements for preservation of available time information, data-source identification, and backend interpretability. The smart-building path integrates an ADXL355 triaxial accelerometer, ESP32-S3, Power over Ethernet (PoE), and Message Queuing Telemetry Transport (MQTT) for 200 Hz vibration acquisition, together with a second-order 10 Hz low-pass filter, 40-record batching, and a Flash LittleFS-based store-and-recovery mechanism that interleaves live and replayed records after reconnection. The construction-site path combines an SCL3300-D01 inclinometer with LoRaWAN, baseline-referenced relative-angle estimation, and a hysteresis state machine with distinct alarm and recovery thresholds. In a 24 h validation, four vibration nodes delivered all 69,120,000 expected records, and four forced-outage trials recovered all offline records while live transmission continued. Frequency-domain analysis confirmed attenuation of high-frequency components while retaining the dominant low-frequency response. The inclination path demonstrated quantifiable angle accuracy, correct alarm/recovery transitions, continuous LoRaWAN frame delivery over the observed interval, and correct backend decoding. The results show that path-specific communication design, combined with a common traceability concept, supports prototype functionality under the reported test conditions, not immediate construction-site deployment. Full 3D visual synchronization, BIM/GIS asset mapping, and digital-twin platform interfacing were not implemented and remain future development tasks.
Authors
- Shih‐Ching Yeh (ORCID: https://orcid.org/0000-0002-4096-6155)
- Eric Hsiao‐Kuang Wu (ORCID: https://orcid.org/0000-0002-1767-2773)
- Hock-Kiet Wong
- Chia-Hau Chen
- Wei-Lin Lee (ORCID: https://orcid.org/0000-0003-2353-5596)
- Tipajin Thaipisutikul (ORCID: https://orcid.org/0000-0002-2538-1108)
- Yi-Hsuan Hsu
Institutions
- National Sun Yat-sen University (TW)
- Minghsin University of Science and Technology (TW)
- National Central University (TW)
- Mahidol University (TH)
- R.O.C Military Academy (TW)
Publication Details
- Journal
- Electronics
- Published
- 2026-09-11
- DOI
- https://doi.org/10.3390/electronics15184118
- Primary Topic
- Structural Health Monitoring Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00