Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing

We demonstrate a novel method for fabricating densely packed, high-aspect-ratio cavities (depth to diameter ratio > 1) in silicon wafers coated with diamond-like carbon (DLC). The process combines femtosecond laser irradiation with subsequent wet etch (potassium hydroxide-based) or plasma etch (chlorine- and oxygen-based). The femtosecond laser is used to pattern precise openings in the DLC layer, exposing the underlying silicon, which is then rapidly etched to form well-defined cavities. This combined laser ablation and etching approach enables high-throughput fabrication of densely packed micrometer cavities and offers scalability toward industrial production. The resulting hybrid DLC-coated silicon structure, featuring densely packed cavities, may exhibit antireflective properties in the far-infrared spectrum range.

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Publication Details

Journal
Nanomaterials
Published
2026-09-10
DOI
https://doi.org/10.3390/nano16181131
Primary Topic
Laser Material Processing Techniques
Type
article
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article

Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing

Yannick Bleu, Xxx Sedao, Émilie Gamet, William Ravisy et al.
Nanomaterials
Laser Material Processing Techniques
article

Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing

Yannick Bleu, Xxx Sedao, Émilie Gamet, William Ravisy, Javier Prada-Rodrigo, Yves Jourlin, Isabelle Verrier, Claire Deeb, Laurent Dubost, Nicolas Crespo-Monteiro, Yoan Di Maio, Agathe Cavanna, Christian Seassal, Antoine Gonon, Razvan Stoian, Ionut-Alexandru Bunea
article en

Abstract

We demonstrate a novel method for fabricating densely packed, high-aspect-ratio cavities (depth to diameter ratio > 1) in silicon wafers coated with diamond-like carbon (DLC). The process combines femtosecond laser irradiation with subsequent wet etch (potassium hydroxide-based) or plasma etch (chlorine- and oxygen-based). The femtosecond laser is used to pattern precise openings in the DLC layer, exposing the underlying silicon, which is then rapidly etched to form well-defined cavities. This combined laser ablation and etching approach enables high-throughput fabrication of densely packed micrometer cavities and offers scalability toward industrial production. The resulting hybrid DLC-coated silicon structure, featuring densely packed cavities, may exhibit antireflective properties in the far-infrared spectrum range.

NanomaterialsVol. 16(18)
Université Claude Bernard Lyon 1 (FR), Centre National de la Recherche Scientifique (FR), École Polytechnique (FR), Institut des Nanotechnologies de Lyon (FR), Laboratoire Hubert Curien (FR), Instituto de Óptica "Daza de Valdés" (ES), Laboratoire des Matériaux Avancés (FR), National Institute for Laser Plasma and Radiation Physics (RO), Groupement d'Intérêt Economique (FR), Université Jean Monnet (FR)
Industry, innovation and infrastructure
Openalex Percentile: Top 13%
Laser Material Processing Techniques
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