Evolution of Microstructure, Mechanical Properties and Crystallographic Orientation for T2 Copper Sheet Processed by Large Deformation Amount Followed by Different Annealing Treatment Processes

Industrial pure copper sheets as a crucial electronic material have currently attracted extensive attention from scholars due to the rapid development of the information technology industry. However, past investigations into the regulation discipline of the microstructure and mechanical properties of pure copper have not paid sufficient attention due to the inevitably low strength induced by the lack of alloying elements. In this study, a typical T2 copper sheet was fabricated by a severe cold-rolling process with a deformation amount of 83% followed by different annealing temperatures ranging from 200 to 500 °C, and the influence of annealing temperature on the evolution of microstructure, mechanical and physical properties and crystallographic orientation (CRO) was investigated systematically. The microstructure features and micro-texture of the studied T2 copper sheet were characterized by optical microscopy (OM) and scanning electron microscopy equipped with electron back-scattered diffraction (EBSD) techniques throughout the entire process from the initial state to the deformed state and annealed state, and the tensile property and electrical conductivity were tested by utilizing a universal testing machine and a digital micro-ohmmeter. Results indicate that the yield strength and tensile strength of the studied T2 copper sheet are both decreased with increasing annealing temperature, accompanied by an increase in electrical conductivity, and the maximum conductivity of up to 98.2% IACS can be reached at the annealing temperature of 500 °C. With the increase in annealing temperature, the degree of recrystallization becomes increasingly sufficient, and the volume fraction of recrystallized grains is increased from ~17.8% to ~35.7% with the annealing temperature increased from 200 to 500 °C. The texture component of the studied T2 copper sheet processed by severe cold rolling with a deformation amount of 83% is characterized by a deformation texture composed of copper texture and S texture, and is then transformed into a texture that predominantly consists of Cube texture under the application of annealing treatment, and the maximum intensity value of Cube texture is enhanced with the increase in annealing temperature.