Shape memory polymer adhesives for on-demand, low-force detachment in skin-interfaced devices
Skin-interfaced biomedical devices require adhesives that provide strong attachment during use while enabling gentle removal with minimized subsurface skin deformation. Conventional medical adhesives lack mechanisms for on-demand adhesion modulation, often causing skin irritation and damage during detachment, particularly in vulnerable populations. Here, we present a thermally triggered shape memory polymer (SMP) adhesive that achieves reversible, high-contrast adhesion switching through programmable pyramidal structure recovery. The adhesive incorporates an array of pyramidal structures that remain flattened in a dormant state to ensure robust skin adhesion, but rapidly recover upon mild heating above the glass transition temperature, significantly reducing effective contact area and enabling low-force detachment. Adhesion switchability performances are supported by quantitative mechanical measurements, including reductions in peel force and adhesion energy after activation, as well as three-dimensional digital image correlation (3D-DIC) analyses demonstrating minimal subsurface skin deformation during detachment. Mechanical testing demonstrates up to ~99% reduction in adhesion energy upon activation, while maintaining stable load-bearing performance during use. 3D-DIC shows that the actuated SMP suppresses stress concentrations and minimizes subsurface skin deformation during detachment, unlike the dormant SMP. A kirigami structural design further enhances conformability on both singly and doubly curved anatomical surfaces while improving water vapor permeability. Finite element analysis and 3D-DIC measurements reveal substantial reductions in effective stiffness and enhanced bending accommodation enabled by the kirigami geometry. Integration with wireless mechano-acoustic sensors confirms reliable physiological signal acquisition in the dormant state and controlled detachment upon activation. This work establishes a thermally switchable SMP adhesive platform for low-force removal of skin-interfaced devices. Skin interfaced devices require strong attachment, though adhesives lack mechanism for on-demand adhesion. Here the authors design a thermally triggered shape memory polymer for reversible adhesion for onskin devices.
Authors
- J H Kim
- Claire Liu (ORCID: https://orcid.org/0000-0003-4308-389X)
- U. Kim (ORCID: https://orcid.org/0009-0000-3540-0029)
- ChangHee Son (ORCID: https://orcid.org/0000-0002-2985-5251)
- John A. Rogers (ORCID: https://orcid.org/0000-0002-2980-3961)
- Min‐Seung Jo (ORCID: https://orcid.org/0000-0003-4486-7725)
- Katherine R. Jinkins (ORCID: https://orcid.org/0000-0001-5757-1136)
- Jay Young Kwak
- Junhyung Kim (ORCID: https://orcid.org/0009-0007-9274-2149)
- Jin‐Tae Kim (ORCID: https://orcid.org/0000-0001-9933-1931)
- Hyein Jung
- Jin-Tae Kim (ORCID: https://orcid.org/0000-0001-9933-1931)
Institutions
- Northwestern University (US)
- Texas Tech University (US)
- Pohang University of Science and Technology (KR)
Publication Details
- Journal
- Nature Communications
- Published
- 2026-09-01
- DOI
- https://doi.org/10.1038/s41467-026-76622-0
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Korea Health Industry Development Institute
- National Research Foundation of Korea