Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy
Low‐melting‐point alloys (LMPAs) have attracted increasing attention for a broad range of emerging applications due to their excellent and unique functional properties. Recently, introducing high‐entropy alloy (HEA) design concepts into LMPA systems has led to the emergence of low‐melting‐point compositionally complex alloys (LMCCAs), which significantly expand the compositional design space of conventional LMPAs. In this review, we summarize the fundamental characteristics and technological importance of traditional LMPAs and discuss how HEA‐inspired design strategies provide new opportunities for tuning their microstructure and functional performance. Recent progress in LMCCA research is analyzed with emphasis on compositional design strategies, representative alloy systems, and their microstructural and functional properties. Particular attention is given to the thermodynamic and kinetic effects arising from multicomponent interactions, which influence phase stability and interfacial reactions such as intermetallic compound (IMC) growth. Through this review, it is hoped to provide some insights for the further development of next‐generation LMCCAs.
Institutions
- City University of Hong Kong (HK)
- Dongguan University of Technology (CN)
- Hua Hong Semiconductor (China) (CN)
- City College of Dongguan University of Technology (CN)
Publication Details
- Journal
- Advanced Engineering Materials
- Published
- 2026-08-27
- DOI
- https://doi.org/10.1002/adem.71209
- Primary Topic
- High Entropy Alloys Studies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- City University of Hong Kong
- Research Grants Council, University Grants Committee