High‐Resolution Patterning of Perovskite Quantum Dots and PEDOT:PSS Using a Solvent‐Free Dry Lift‐Off

As a critical step in micro- and nanofabrication, the resist lift-off process plays an important role in enabling pattern transfer and device integration. The challenge lies in achieving resist removal without compromising the integrity or functionality of underlying materials. Conventional wet lift-off approaches rely on hazardous solvents and high energy consumption. They also suffer from solvent-induced swelling, which limits compatibility with many sensitive functional materials. Here, we develop a dry lift-off process based on interfacial adhesion modulation, applicable to sensitive optoelectronic materials such as perovskite quantum dots and PEDOT:PSS. The lift-off behavior of the resist was further validated through mechanical and interfacial fracture theoretical analyses. High-density patterns of both perovskite quantum dots and PEDOT:PSS were achieved across diverse substrates at a resolution of 5 µm, over wafer-scale areas (up to 4 inches), with a lift-off yield approaching 100%. Furthermore, the introduction of an undercut architecture in PEDOT:PSS improves structural integrity while preserving electrical conductivity. This work provides a scalable, efficient, and environmentally benign route for the large-area, high-fidelity patterning of sensitive functional materials.