Optoelectronics on ferrule: Challenges and opportunities for fiber-to-laser coupling

Optoelectronics on fiber technology represents a promising approach for realizing extremely compact devices directly integrated and efficiently coupled to optical fiber. In this direction, we propose a new approach, compatible with scalable manufacturing, based on bonding the optoelectronic chip on a metallized ferrule, allowing the insertion and fine adjustment of the fiber inside the ferrule after the chip integration. This new flexible configuration enables the same chip to be tested under different conditions, for investigating the influence of different parameters on the coupling efficiency. As a proof-of-concept, our approach was applied to the integration of miniaturized Vertical-Cavity Surface-Emitting Lasers (VCSELs). The effects of the laser-to-fiber distance and radial and angular offsets on the coupling efficiency were investigated both numerically and experimentally. A coupling efficiency of more than 60 % for the SMF was obtained, representing a significant improvement over the state-of-the-art.

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Publication Details

Journal
Optics & Laser Technology
Published
2026-08-26
DOI
https://doi.org/10.1016/j.optlastec.2026.116243
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
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article

Optoelectronics on ferrule: Challenges and opportunities for fiber-to-laser coupling

Alberto Micco, Federica Piccirillo, Andrea Cusano, Michael Jetter et al.
Optics & Laser Technology
Semiconductor Lasers and Optical Devices
article

Optoelectronics on ferrule: Challenges and opportunities for fiber-to-laser coupling

Alberto Micco, Federica Piccirillo, Andrea Cusano, Michael Jetter, Simone Luca Portalupi, Katharina Dahler, Armando Ricciardi, Peter Michler, Michael Zimmer
article en

Abstract

Optoelectronics on fiber technology represents a promising approach for realizing extremely compact devices directly integrated and efficiently coupled to optical fiber. In this direction, we propose a new approach, compatible with scalable manufacturing, based on bonding the optoelectronic chip on a metallized ferrule, allowing the insertion and fine adjustment of the fiber inside the ferrule after the chip integration. This new flexible configuration enables the same chip to be tested under different conditions, for investigating the influence of different parameters on the coupling efficiency. As a proof-of-concept, our approach was applied to the integration of miniaturized Vertical-Cavity Surface-Emitting Lasers (VCSELs). The effects of the laser-to-fiber distance and radial and angular offsets on the coupling efficiency were investigated both numerically and experimentally. A coupling efficiency of more than 60 % for the SMF was obtained, representing a significant improvement over the state-of-the-art.

Optics & Laser TechnologyVol. 203
University of Sannio (IT), Center for Integrated Quantum Science and Technology (DE)
Openalex Percentile: Top 19%
Semiconductor Lasers and Optical Devices
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