Regulating phonon-carrier transport by interfacial symmetry breaking in thermoelectric multilayers
More than half of global primary energy is dissipated as low-grade waste heat, yet thermoelectric conversion remains constrained by the intrinsic coupling between phonon and charge transport. Here, we introduce graded interfacial size distribution as a thermodynamic design variable that breaks translational symmetry in multilayers, enabling anisotropic regulation of phonon-carrier transport. Using bismuth telluride (Bi 2 Te 3 )/metal [gold, silver, and platinum (Pt)] multilayers as a model system, we demonstrate that multiscale interface distributions induce broadband phonon suppression through the coexistence of interfacial scattering, coherent interference, and localization. This yields an ultralow cross-plane thermal conductivity of 0.22 watts per meter per kelvin and a high room-temperature ZT of 1.51 in Bi 2 Te 3 /Pt films. Concurrently, asymmetric metal-semiconductor interfaces create quasi–two-dimensional accumulation channels that enhance in-plane carrier mobility while preserving energy filtering, delivering a power factor of 176.2 microwatts per centimeter per square kelvin at 300 kelvin. The graded architecture enables high performance in both vertical and flexible planar devices, illustrating a general strategy in which interface distribution, not merely composition, governs anisotropic heat-charge transport. Our findings establish statistical interface engineering as a platform for thermoelectric energy harvesting and solid-state cooling.
Authors
- Zhihao Guan
- Moran Wang (ORCID: https://orcid.org/0000-0002-0112-5150)
- Zhiyu Hu (ORCID: https://orcid.org/0000-0003-1114-052X)
- Zhenhua Wu (ORCID: https://orcid.org/0000-0002-5527-0310)
- Yutao Han (ORCID: https://orcid.org/0000-0003-0803-4910)
- Wenpei Gao (ORCID: https://orcid.org/0000-0002-2776-2676)
- Quanxin Guo (ORCID: https://orcid.org/0000-0002-7887-3042)
- Kun Yang (ORCID: https://orcid.org/0000-0002-8891-5736)
- Yakun Yuan (ORCID: https://orcid.org/0000-0001-7384-9767)
- Shuai Zhang (ORCID: https://orcid.org/0000-0001-7617-9201)
- Zhengtong Yao (ORCID: https://orcid.org/0009-0008-1979-2163)
- Bin Liu (ORCID: https://orcid.org/0009-0003-4350-9974)
Institutions
- City University of Hong Kong (HK)
- Shanghai Jiao Tong University (CN)
- Tsinghua University (CN)
Publication Details
- Journal
- Science Advances
- Published
- 2026-08-21
- DOI
- https://doi.org/10.1126/sciadv.aeh5460
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China