Microstructure and Corrosion Resistance of Sn-3Ag-0.5Cu-xBi Solders

Sn-3Ag-0.5Cu-xBi alloys (SAC305-xBi) represent promising lead-free alternatives for low-temperature soldering. Low Bi concentrations can strengthen SAC-based solders through solid-solution strengthening, refining β–Sn grains and transforming needle-like Ag3Sn phases into equiaxed morphologies. However, excessive Bi alloying may induce precipitation of brittle Bi particles, cause microstructural instability and interfacial degradation, thereby weakening the solder joint performance. As such, the concentration of Bi in the SAC305 alloys should be carefully controlled. In this work, the microstructure and corrosion behavior of Sn-3Ag-0.5Cu-xBi solder alloys (SAC305-xBi, where x = 0, 1, 2 and 4 wt. %) were investigated. Attention has been paid to the influence of low Bi concentration on the microstructure, morphology, and chemical composition of the phases present in the solder alloys before and after corrosion exposure. The alloys were prepared by induction melting of Sn, Ag, Cu and Bi lumps under Ar gas. The microstructure of the SAC305 and SAC305-1Bi alloys represented a hypoeutectic microstructure with dendritic (Sn) grains and the ternary eutectic, consisting of (Sn), Cu6Sn5 and Ag3Sn, located in inter-dendritic regions. In the SAC305-2Bi and SAC305-4Bi alloys, a segregation of (Bi) particles was observed in addition to dendritic (Sn) and ternary eutectic. The (Bi) particles were located at the (Sn)Ag3Sn interface in the inter-dendritic spaces of the (Sn) solid solution. The corrosion resistance of the as-cast alloys was studied in aqueous NaCl electrolyte (3.5 wt. %) using electrochemical methods. Open circuit potentials of the alloys were found to increase with increasing concentration of Bi. The highest corrosion current was found for the SAC305-1Bi alloy. It was observed that micro-galvanic cells at the Sn-Ag3Sn interface were the initiating factors of corrosion in the SAC305-1Bi alloy. The corrosion activity of the SAC305-1Bi alloy is related to the high density of fine Ag3Sn particles. The higher fraction of Ag3Sn particles provided a dense network of local galvanic interaction sites, leading to the acceleration of the corrosion rate. The presence of discrete Bi precipitates in the SAC305-2Bi and SAC305-4Bi alloys, on the other hand, partially reduced the risk of galvanic corrosion. Since Bi has a higher standard electrode potential compared to Sn, the Bi/Ag3Sn and Bi/Cu6Sn5 couples were less prone to corrosion. The corrosion mechanism of the SAC305-xBi alloys is discussed, and results are compared to previously studied SAC-Bi alloys.