High current ultrawide bandgap AlGaN pin diodes with low on-resistance and UVC emission
We report ultrawide-bandgap AlGaN pin diodes with high forward current density and deep-ultraviolet (DUV) electroluminescence signaling efficient carrier injection. The devices incorporate a 100 nm unintentionally doped intrinsic layer between polarization-doped n- and p-type regions, grown by plasma-assisted molecular beam epitaxy on bulk AlN substrates. Electrical characterization reveals current densities up to ∼28 kA/cm2, differential on-resistances below 1 mΩ cm2, ideality factors approaching 1.7, and a cutoff frequency fco = (2πRonCoff)−1 = 30.8 GHz. Capacitance–voltage measurements confirm a reduced junction capacitance relative to a pn diode without the i-layer, while electroluminescence shows ultraviolet emission at 248 nm from the polarization-doped regions. These results establish AlGaN pin diodes as a promising platform for high-speed, high-voltage, and DUV optoelectronic devices, offering a scalable approach to next-generation ultrawide-bandgap electronics and photonics.
Authors
- Vladimir Protasenko (ORCID: https://orcid.org/0000-0002-8469-1157)
- Debdeep Jena (ORCID: https://orcid.org/0000-0002-4076-4625)
- Madhav Ramesh (ORCID: https://orcid.org/0000-0003-0396-561X)
- Shivali Agrawal (ORCID: https://orcid.org/0009-0006-7989-7667)
- Huili Grace Xing (ORCID: https://orcid.org/0000-0002-2709-3839)
- Hsin-Wei Huang
- Debaditya Bhattacharya (ORCID: https://orcid.org/0000-0002-9217-1813)
Institutions
- Cornell University (US)
Publication Details
- Journal
- Journal of Applied Physics
- Published
- 2026-08-14
- DOI
- https://doi.org/10.1063/5.0341198
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Science Foundation
- Defense Sciences Office, DARPA