Strategies for the Integration of Multifunctional Thermal Management Materials: A Review
The rapid development of high-power electronics, flexible devices, and advanced energy systems has created a growing demand for thermal management materials that combine heat dissipation with additional functions such as electrical insulation, electromagnetic interference shielding, flame retardancy, mechanical compliance, and environmental stability or other application-specific functions. The central challenge in multifunctional thermal management materials (MTMMs) lies not simply in improving thermal conductivity but in integrating thermal management with other required functions within the same material system. From the perspective of functional integration, this review classifies MTMMs as passive or stimuli-responsive. Passive MTMMs rely on material composition, filler design, and structural construction to form heat-conduction pathways while supporting other functions. Stimuli-responsive MTMMs regulate heat transport and associated functional performance through reversible changes induced by electric or magnetic fields, light, or humidity. This classification clarifies the design logic, relationships among integrated functions, and applicability of different MTMM systems. Representative applications, including wearable electronics and battery thermal management, are also discussed to connect material design to practical requirements. Future research directions include recyclable MTMMs, long-term thermomechanical stability, and AI-assisted analysis of structure-function relationships. This review provides a systematic perspective for the development of next-generation thermal management materials.
Authors
- Jianan Song (ORCID: https://orcid.org/0000-0001-7395-6474)
- Kan Zhang (ORCID: https://orcid.org/0000-0003-4628-2704)
- Beibei Chen (ORCID: https://orcid.org/0000-0003-3625-7281)
- Feng Wei
- Guangxing Huang
- Chao Hu
- Lingxiao Sun
Institutions
- Jiangsu University (CN)
Publication Details
- Journal
- ACS Applied Materials & Interfaces
- Published
- 2026-08-14
- DOI
- https://doi.org/10.1021/acsami.6c10266
- Primary Topic
- Thermal properties of materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China