Improvement in Adhesive Properties of Hydrocarbon Resins by Incorporation of <scp>KH570</scp>

ABSTRACT Hydrocarbon resins exhibit superior dielectric properties, rendering them promising candidates for advanced high‐performance printed circuit boards (PCBs). Nevertheless, their insufficient adhesive performance severely restricts their practical applications. In this work, KH570 was covalently incorporated into poly(divinylbenzene/styrene/4‐tert‐butylstyrene)‐styrene‐butadiene‐styrene (PDVs‐SBS) copolymers with excellent dielectric properties via atom transfer radical polymerization (ATRP) to effectively enhance the peel strength of the resin matrix. The resulting polymer not only maintains excellent dielectric performance (dielectric constant: 2.12–2.62, tan δ : 0.003–0.005 at 10 GHz), high thermal stability ( T g &gt; 160°C, T d5% &gt; 365°C) and low water absorption (&lt; 0.55%), but also achieves significantly improved interfacial adhesion (peel strength increases from 0.61 to 1.55 N/mm). The results indicate that KH570‐modified hydrocarbon resins possess greater potential for applications in high‐frequency and high‐speed PCBs.