Soft Double‐Sided Conductive Nanocomposite Tapes for Versatile Assembly of Stretchable Electronics

ABSTRACT The hybrid integration of soft, deformable devices with rigid silicon‐based circuitry is essential for realizing next‐generation stretchable electronics capable of complex data processing and communication. A critical challenge in this field is the lack of a reliable and universal strategy for establishing robust electrical and mechanical interfaces between the disparate electronic platforms. Here, we introduce a soft, double‐sided conductive nanocomposite tape that serves as a universal bonding layer to overcome this interconnection bottleneck. Fabricated via a scalable spray‐deposition process, the tape consists of silver nanowires (Ag NWs) embedded in a tackified styrene–isoprene–styrene (SIS) elastomer matrix. The high‐aspect‐ratio nanowire fillers enable high electrical conductivity (∼10 4 S/cm) at minimal loadings, while preserving ample elastomer surface to ensure strong adhesion strength. This design enables rapid assembly at room temperature using a “press‐and‐peel” lamination procedure, eliminating the need for surface treatments or thermal bonding. The resulting modular assemblies maintain their integrity under large and repeated tensile deformations. We demonstrate the versatility of this approach by creating stretchable PCB cables, multi‐channel epidermal sensor patches, and soft LED displays. This work establishes a scalable and universally applicable strategy for modular assembly in complex stretchable electronic systems.