Hoop Tensile Failure Stress of 500 µm‐Diameter Ceramic Spheres

ABSTRACT The tensile failure stress of a brittle‐material sphere is important to the survival of the sphere itself but is particularly relevant to systems that employ such spheres for applications in which the sphere exterior is subjected to tension during system fabrication or operation. That maximum hoop or tangential stress can be measured by diametrally compressing a C‐sphere specimen directly machined from such spheres. This combination of specimen geometry and test method was conceived at Oak Ridge National Laboratory around 20 years ago. Although the C‐sphere geometry has been tested with larger spheres, the ease and efficacy of its testing are unknown for submillimeter sphere diameters. To consider this, C‐sphere specimens were machined from yttria‐stabilized zirconia (YSZ) spheres of ∼500 µm diameter. The maximum (hoop or tangential) tensile stress was determined as a function of compressive failure force and specimen dimensions using finite element analysis. Companion effective area and volume as a function of Weibull modulus were computed. Hoop tensile failure stresses were then measured and fractography conducted to examine flaw type and location and to estimate the mirror constant of this YSZ grade. This novel study demonstrates that hoop tensile failure stress can be determined with sub‐millimeter brittle‐material spheres.