Photoelectric Intelligent Sensor Chip: From Device to System

Photoelectric intelligent sensor chips have become a key technology for next-generation intelligent sensing by integrating photonic devices, electronic circuits, and artificial intelligence algorithms. Recent advances in silicon photonics, two-dimensional materials, heterogeneous integration, and intelligent signal processing have significantly improved their sensitivity, response speed, and integration capability. This review presents a comprehensive overview of photoelectric intelligent sensor chips from fundamental principles to system-level applications. The operating mechanisms, device architectures, fabrication technologies, and photonic integration strategies are summarized, followed by recent progress in industrial, medical, and intelligent sensing applications. Current technical challenges, including material quality, heterogeneous integration, power consumption, and intelligent data processing, are also discussed. Finally, future trends toward highly integrated, low-power, and AI-enabled sensing systems are highlighted. This review provides a concise reference for the development of next-generation photoelectric intelligent sensor chips and their practical applications.

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Publication Details

Journal
Photonics
Published
2026-07-26
DOI
https://doi.org/10.3390/photonics13080703
Primary Topic
CCD and CMOS Imaging Sensors
Type
article
Field-Weighted Citation Impact
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article

Photoelectric Intelligent Sensor Chip: From Device to System

J K Chen, Weiqing Cheng, 吳惠足
Photonics
CCD and CMOS Imaging Sensors
article

Photoelectric Intelligent Sensor Chip: From Device to System

J K Chen, Weiqing Cheng, 吳惠足
article en

Abstract

Photoelectric intelligent sensor chips have become a key technology for next-generation intelligent sensing by integrating photonic devices, electronic circuits, and artificial intelligence algorithms. Recent advances in silicon photonics, two-dimensional materials, heterogeneous integration, and intelligent signal processing have significantly improved their sensitivity, response speed, and integration capability. This review presents a comprehensive overview of photoelectric intelligent sensor chips from fundamental principles to system-level applications. The operating mechanisms, device architectures, fabrication technologies, and photonic integration strategies are summarized, followed by recent progress in industrial, medical, and intelligent sensing applications. Current technical challenges, including material quality, heterogeneous integration, power consumption, and intelligent data processing, are also discussed. Finally, future trends toward highly integrated, low-power, and AI-enabled sensing systems are highlighted. This review provides a concise reference for the development of next-generation photoelectric intelligent sensor chips and their practical applications.

PhotonicsVol. 13(8)
China University of Petroleum, Beijing (CN)
Affordable and clean energy
Openalex Percentile: Top 15%
CCD and CMOS Imaging Sensors
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