Photoelectric Intelligent Sensor Chip: From Device to System
Photoelectric intelligent sensor chips have become a key technology for next-generation intelligent sensing by integrating photonic devices, electronic circuits, and artificial intelligence algorithms. Recent advances in silicon photonics, two-dimensional materials, heterogeneous integration, and intelligent signal processing have significantly improved their sensitivity, response speed, and integration capability. This review presents a comprehensive overview of photoelectric intelligent sensor chips from fundamental principles to system-level applications. The operating mechanisms, device architectures, fabrication technologies, and photonic integration strategies are summarized, followed by recent progress in industrial, medical, and intelligent sensing applications. Current technical challenges, including material quality, heterogeneous integration, power consumption, and intelligent data processing, are also discussed. Finally, future trends toward highly integrated, low-power, and AI-enabled sensing systems are highlighted. This review provides a concise reference for the development of next-generation photoelectric intelligent sensor chips and their practical applications.
Authors
- J K Chen (ORCID: https://orcid.org/0000-0001-9389-520X)
- Weiqing Cheng (ORCID: https://orcid.org/0000-0003-1062-0636)
- 吳惠足
Institutions
- China University of Petroleum, Beijing (CN)
Publication Details
- Journal
- Photonics
- Published
- 2026-07-26
- DOI
- https://doi.org/10.3390/photonics13080703
- Primary Topic
- CCD and CMOS Imaging Sensors
- Type
- article
- Field-Weighted Citation Impact
- 0.00