Simultaneous Chemical Etching and Electrical Interconnection in Perovskite Solar Modules Enabled by Conductive Silver Adhesive

Series interconnection technology is critical to the practical application of perovskite solar modules. However, as a core step in the interconnection structure, the P2 process remains challenged by thermal damage, process complexity, and high costs associated with traditional laser scribing techniques. This work introduces a novel strategy using a low‐temperature‐cured conductive silver adhesive (CSA) as a simultaneous etchant and conductor in P2 process for perovskite solar modules. During CSA curing, its amine‐based hardener selectively removes the perovskite and hole‐transport layer, while the silver filler forms series connection with the bottom FTO electrode. Optimized at 90 °C and a 0.08 cm line width, the CSA‐etched mini‐modules achieved a champion efficiency of 17.96%, rivaling laser‐ablated devices (18.36%). Crucially, by avoiding thermal damage, CSA‐etched devices exhibited better storage stability under unencapsulated ambient conditions (25 °C, 25% RH), retaining 89% of their initial performance after 30 days, compared with 72% for laser‐etched devices. This low‐temperature CSA etching strategy offers a feasible alternative to high‐precision laser P2 scribing in perovskite solar modules, reducing reliance on ultrafast laser equipment while enabling simultaneous removal of perovskite functional layers and electrical interconnection, thereby potentially lowering manufacturing costs.